In line with the increasing performance of electrical components, microchips and many other materials, interesting challenges arise for the chemical products used. Current products and developments in this area include UV-based varnishes for printed circuit boards, numerous potting materials (e.g. 2C epoxy potting in the category picture) and fillers for e.g. flip-chip connections. Thermally conductive pastes, but also thermally conductive adhesives belong to our main components of the product range.
- Acrylic and epoxy-based lacquers/varnishes
- Thermally conductive adhesives and pastes
- Conductive and anti-static adhesives
For component protection, we offer varnishes moisture resistant and fire-retardant potting compounds (UL-tested) in class V0. The potting compounds are characterized by a low reaction-enthalpy, so that even large depths (e.g. 10 cm) can be poured. Besides epoxy resins, there are very fast UV acrylates with a dual curing mechanism; the moisture post-curing allows undercuts to cure without any problems without exposure to light. Because total polymerisation is always ensured, no residual monomers remain.